L6316
4-CHANNEL LOW POWER PREAMPLIFIER
DATA BRIEF
1
FEATURES
Dual Power Supplies of +5V, 10% and -3v, 6% Low Power consumption; 980 mW @ 800Mb/s (Single Head 100% Write mode duty cycle, Random pattern, Iw = 40mA, Max Ovs). Flip Chip package.L6316 Differential Voltage Bias / Voltage Sense architecture. Current Bias available Programmable read input differential impedance. Selectable read path bandwidth from 200 to >600 MHz (Rmr=40). (Parameter dependent on interconnect) Selectable LF corner (1, 2.5, 3.5 or 5.5 MHz with RMR=40). Noise Figure of merit; 2.2 dB (Rmr=40) MR bias voltage programmable from 70 to 225 mV nom. (5 bits) (7.2mA max). MR bias current programmable from 0.65 to 7.2 mA nom. (5 bits) (225mV max). Read input stage optimized for MR resistance from 20 to 70 Ohm. Programmable read voltage gain of 37, 40, 43, 46 dB Rmr = 40, Rload = 100 Fully Differential write driver: Programmable overshoot amplitude (3bits) and duration (2bits). Write current rise/fall time with custom head and interconnect model 140 pS at 40 mA (10% to 90%) (Steady state to steady state) Write current amplitude programmable (5 bits) 0 to 62 mA (0-pk). Bi-directional 16-bit serial interface 2.5V and 3.3V CMOS compatible. 2-pin (RXW and TFI), 2 bits mode selection (WAKE, ENTFI). All control signals are 2.5 & 3.3V CMOS compatible. Analog buffered head voltage ABHV (gain of 5) Automatic digital MR resistance measurement (7 bits). Read head open detection, Read head shorted detection. Write head open or shorted to ground, Writer to Reader short, write data frequency too low detection. SAFEDETECT method for write fault detection.
Figure 1. Package
Flip Chip
Table 1. Order Codes
Part Number L6316
Package Flip Chip
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Low VCC or VEE supply & die over temperature detect, Analog Temperature Measurement. Fast write-to-read recovery 150nS (max) (same head). Head-to-head switch in read mode 1.5us (nom). Zero MR bias, very low power (43mW) idle mode with fast recovery to read mode 1.5us (nom). MR bias switching without overshoot for head protection. Read-to-Write switching 50nS (max) (same head). ESD diodes for MR head protection
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The L6316 is a BICMOS Silicon Germanium integrated circuit differential preamplifier. It is designed for use with four-terminal MR read and inductive write heads. In read mode, the device consists of a fully differential amplifier, offering; voltage or current bias, voltage-sense input, programmable input impedance, low noise and high bandwidth. In write mode, it includes fast current switching differential write drivers, which support data rates up to 1200 Mb/s. This preamplifier provides programmable read voltage or current bias and write current (5 bit DACs for the read bias and for the write current), fault detection circuitry and servo track writing features. Read amplifier gain, low corner frequency, and write current wave shape are adjustable. The amplitude and duration of the overshoot are separately programmable through a 16-bit bi-directional serial interface (SEN, SDATA, and SCLK). The device operates from +5V and -3V supplies.
Rev. 1 1/6
September 2004
This is preliminary information on a new product now in development. Details are subject to change without notice.
L6316
Figure 2. Preamplifier Block Diagram
VCC (+5V)
VGND (0V)
VEE (-3V)
HW0X WDX
PREDRIVER
HW0Y HW1X
FAULT PROCESSOR
WDY
WRITE DRIVERS
HW1Y HW2X HW2Y HW3X
Overshoot
FLT
Low supply detection, Open/short heads, Low write frequency, High temperature
SDATA SCLK SEN
3v
SERIAL INTERFACE CONTROL Vmr, Iw RW enable head select HEAD SELECTION & MODE CONTROL
WRITE DAC
RXW
3v
ABHV, MR meas, TEMP meas
TFI
RDX RDY
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Gain boost Low pass filter
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Temperature monitoring
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READ BIAS DAC
Current/volt age bias
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HR0X HR0Y MR READ INPUT STAGES HR1X HR1Y HR2X HR2Y HR3X
Rin DAC
High pass filter
L6316
HR3Y
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L6316
Figure 3. Flip Chip Pinout Diagram - BUMPS DOWN Note: Minimum pad pitch = 204 um and pad opening (octagonal) = 70 um Bump Sequence (see next table for coordinates)
TF VEE GND VCC HR3Y HR3X
SDEN
WDY WDX SCLK RDX RDY SDATA RXW FLT 0,0
HW3Y HW3X HW2X HW2Y HW1Y HR2X
HR2Y HR1Y
HW1X HW0X
HR1X
VEE GND VREF VCC
Die dimensions:
Minimum distance between pads opening center to center: Wafer thickness: Bump height: Bump diameter:
Die center misalignment w.r.t original die center after cut:
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Bump material if eutectic: Bump material if lead free:
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HR0Y
HR0X
X = 2192 20 um Y = 2686 20 um 204um 500 20 um 90 15 um 120 15 um 38 um 63% Tin, 37% Lead 96% Tin, 3.5% Silver, 0.5% Copper
Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.
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L6316
Table 2. Bump Coordinates (bumps down, from center of die, dimensions in microns).
Pin name HR3Y HR3X HW3Y HW3X HW2X HW2Y HR2Y HR2X HR1X HR1Y HW1Y HW1X HW0X HW0Y HR0X HR0Y VCC X-coord (um) 471 775 141.1 141.1 141.1 141.1 686 890 890 686 141.1 141.1 141.1 141.1 775 471 -7 4 Y-coord (um) 1140 1140 813.7 566.7 362.7 115.7 102 252 -252 -102 -115.7 -362.7 -566.7 -813.7 -1140 -1140 -1140 Pin name VREF GND VEE FLT RXW SDATA RDY RD X SCLK WD X WDY SDEN TF I VEE GND X-coord (um) -278 -482 -686 -890 -890 -890 -890 -890 -890 -890 -890 -890 Y-coord (um) -1140 -1140 -1140 -816 -612 -408 -204 0
Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.
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408 612 816 1140 1140 1140 1140 -
204
-482
-278
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L6316
Table 3. Revision History
Date September 2004 Revision 1 Description of Changes First Issue in EDOCS dms.
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L6316
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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