Stacked die technology has enabled
ST to cost effectively meld EEPROM technology with our low power
HCMOS devices to bring a new level in RTC functionality without
having to overcome the challenges of fabricating EEPROM and RTC
elements on the same die. The M41T56C64, the first device in the
series, also integrates the crystal, and allows the user to access,
via a two-wire I2C bus, 56 bytes of NVRAM, 8 bytes of clock registers
and 8K bytes of EEPROM, all in a single, space saving 18-pin SOIC.
M41T56C64: EEPROM die stacked on an RTC |
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