OEMs face the challenge of providing 2.5G and 3G base stations that are compliant with the latest releases of the 3rd-generation partnership program (3GPP) standard, while offering a substantial cost reduction in the complete system. This can only be achieved through the super integration of DSP cores, MCU cores, memories, and other specific modules on a single chip (system-on-chip or SoC).
At the heart of cost-effective wireless infrastructure systems, ST's low-cost baseband modem is an integrated system-on-chip solution. It was defined in cooperation with leading wireless-infrastructure manufacturers to outperform the existing 2.5G and 3G baseband modems.
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Multi-standard 3G (WCDMA, CDMA2000, TD-SCDMA), 2G/2.5G
and WiMAX |
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Lowest cost per channel and highest channel density
in the industry |
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Full software implementation (chip rate, symbol
rate) of 3G nano- and pico-cell base stations |
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Two quad-MAC ST140 DSP cores running at 600 MHz and a standard
ARM926-EJS RISC processor core running at 300 MHz, providing
a total of 29000 Mops, 7500 Mips, 4800 MMacs/s |
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16-Mbit embedded SRAM |
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Baseband modem SoC and DSP cores |
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