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MOSFET - STripFET III Technology

EHD Evolution table
Parameter EHD1
“NE”
EHD2
“NF-L”
EHD2
“NF-LL”
EHD3
“NH”
Channel Per. / Area 16.7m/cm2 38.5m/cm2 38.5m/cm2 62m/cm2
Channel Length 1.2µm 0.8µm 0.8µm 0.17µm
RDS(on) * Area@20V 1.8mOhm*cm2@5V
1.54mOhm*cm2@10V
1.5mOhm*cm2@5V
0.84mOhm*cm2@10V
1.08mOhm*cm2@4.5V
0.84mOhm*cm2@10V
0.4mOhm*cm2@4.5V
0.286mOhm*cm2@10V
RDS(on)* Qg 810mOhm*nC@5V
1170mOhm*nC@10V
330mOhm*nC@5V
350mOhm*nC@10V
282mOhm*nC@4.5V
429mOhm*nC@10V
160mOhm*nC@5V
172mOhm*nC@10V

MOSFET STripFET III Relative Efficency at 500kHz
MOSFET STripFET III Buck Converter
Relative Efficiency at 500kHz
Single Phase VIN=12V VOUT=2V
Buck Converter

MOSFET STripFET III Evaluation circuit for efficiency
Evaluation Circuit for Efficiency

STripFET III Benefits

The main electrical characteristics such as the current capability and RDS(on) are strictly dependent on the channel perimeter per unit area.

Very low RDS(on) gives low conduction losses
Cost effectiveness
Excellent switching behaviour
Reduced power losses of the diode.
MOSFET STripFET III Normalized figure of merit at 4.5V through the EHD generations
Normalized figure of merit at 4.5V through the EHD generations
The EHD3, thanks to the decreased strip width, gains 38% in the channel perimeter per unit area, with respect to the second generation, this also means a great benefit in terms of RDS(on)
The figure of merit (RDS(on) *Qg) has been slashed by 43%. The following graph explains the trend in this parameter, which is of paramount importance in many applications.
On account of the main power supply requirement to operate at the highest efficiency, special attention has been given to the reverse recovery characteristic of the parasitic body diode.
In particular the Qrr is 39% smaller than in the previous EHD generations. Moreover, the low intrinsic resistance, Rg (<1.9ohm) is of outstanding importance to reduce the gate driving power losses. All these improvements are useful attributes in applications, especially for synchronous rectification for motherboard market, that allow us to consider the EHD3 technology as a benchmark in the low voltage scenario.
Bondless SO-8 Frame
Synchronous buck converter for computer and telecom applications.

Product Range
The effective improvement in the technology has been combined with new packages and new bonding techniques. The bondless SO-8 and PowerSO-8 are the most attractive solutions with a standard pin-out configuration of SO-8. The new ClipPAK has the same clip concept already adopted in the SO-8 package, but without any external difference from a standard DPAK. EHD3 in PowerFLAT and in PowerSO-8 with clip mounting will be available shortly.
MOSFET - STripFET III
Vertical sections of two EHD generations, showing the decreased strip width and a consequent strip density increase of nearly 40% in the third generation

STripFET III Features


The EHD3, thanks to the decreased strip width, gains 38% in the channel perimeter per unit area, with respect to the second generation, this also means a great benefit in terms of RDS(on)
The figure of merit (RDS(on) *Qg) has been slashed by 43%. The following graph explains the trend in this parameter, which is of paramount importance in many applications.
On account of the main power supply requirement to operate at the highest efficiency, special attention has been given to the reverse recovery characteristic of the parasitic body diode.
In particular the Qrr is 39% smaller than in the previous EHD generations. Moreover, the low intrinsic resistance, Rg (<1.9ohm) is of outstanding importance to reduce the gate driving power losses. All these improvements are useful attributes in applications, especially for synchronous rectification for motherboard market, that allow us to consider the EHD3 technology as a benchmark in the low voltage scenario.