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MDmeshT MOSFET Technology Slashes On-Resistance

MDmesh Datasheets
MDmesh Press Release

ST MDmesh technology cuts ON-resistance by a factor of three to four, depending on voltage, compared to traditional power MOSFETs. The new technology is called MDmeshT (Multiple Drain mesh) because it combines ST's patented Mesh Overlay horizontal layout with a novel drain structure based on multiple vertical p-strip drain. In addition to the extremely low ON-resistance, the new drain structure results in excellent dV/dt and avalanche characteristics, while the strip layout geometry gives a dynamic performance that is significantly better than that of similarly rated competitive products.


MDmesh MOSFET

New Drain Structure

Simplified drawing of MDmesh 3D structure The key to MDmeshT's outstanding performance is a new drain structure in which the drain is implemented as an array of partitions, with vertical p-type drain strips aligned with the horizontal n-type source strips that are the key feature of the Mesh Overlay technology. This approach allows breakdown voltage to be more than doubled compared to conventional drain structures; for example, an MDmeshT MOSFET designed to withstand 500V exhibits the same drain resistivity and thickness as that of a conventional 200V MOSFET, which means that an MDmeshT MOSFET will have a much lower ON-resistance than conventional devices designed to withstand the same source-drain breakdown voltage. The process used to build the vertical structure has been optimized to allow high process capability and high yield.
   


In the PC and lighting market the 2% increase in efficiency translates into a significant and measurable saving in worldwide energy consumption and CO2 emission, reconfirming ST's commitment environmental protection.


Benefits

Smaller heatsinks
Cost saving
Higher efficiency
Safe operation in bridge topologies


Features

Drastic reduction of on-resistance
Gate resistance minimized
3 times lower gate charge than std. MOSFETs
Improved diode dv/dt capability
On-losses reduction
Turn-off improvement and reduction in switching losses
Input and output capacitances smaller than std. MOSFETs

The Mesh Overlay technique pioneered by ST back in 1995 has allowed a tight control of the internal gate resistance and improve the gate charge by roughly 3 times resulting in a remarked improvement of its dynamic capability.
The MDmesh family will also feature built-in fast recovery diodes ”FRED” to suit the ever spreading ZVS (zero voltage switching) phase-shift topologies.
STP6NB50
MDmesh
Output characteristics of MDmesh™ versus standard MOSFET

MDmesh with fast recovery diodesThe increasing demand for more efficient AC-DC converters as those requested by the booming telecom market is naturally matched by the MDmesh due to its lower switching losses (because of lower intrinsic capacitance, shorter delay time, shorter crossover time and much smaller gate charge) and lower on-state losses (because of reduced RDS(on)).
The lower gate charge greatly simplifies gate drive circuits.


40% Lower Gate Charge

Because MDmesh™ also includes the highly successful Mesh Overlay process and a gate finger layout that provide a highly effective means of controlling internal gate resistance, the new technology also offers outstanding dynamic performance, significantly better than similar products from competition power MOSFETs. For example, gate charge is typically more than 40% lower than competitive devices, leading to faster turn-off and lower switching losses.


Unsurpassed dV/dt Capability

MDmesh™ devices also exhibit the other major Mesh Overlay benefits, including a simplified manufacturing process with precision alignment required in only one dimension instead of two, and reduced corner effects, leading to better electrical breakdown characteristics. As a result, MDmesh™ devices exhibit unsurpassed dV/dt capability and avalanche ruggedness.
faster turn-off and lower switching losses

The X factor

Low on-resistance is a highly desirable characteristic in a power MOSFET but it is not the only factor contributing to total losses. What gives MDmesh technology its overwhelming superiority over other power MOSFET technologies is the "cross-fertilization" factor - the combination of the vertical drain structure with ST's proprietary Mesh Overlay horizontal layout. The Mesh Overlay technique allowed ST designers to maintain a tight control of the internal gate resistance, now guaranteed in the datasheet. The gate charge is reduced by roughly a factor 3. Thus greatly improving the dynamic capability. In addition, the temperature dependence of the on-resistance is also reduced compared to conventional high voltage MOSFETs.


External gate resistance 4.7 Ohm

MDmesh MOSFET
MDmesh MOSFET
With guaranteed low gate resistance, MDmesh greatly reduces the delay time, allowing faster switching time for more efficient SMPS design. Competition trials show inferior switching performance due to a longer delay time.

MDmesh design has been fully optimized for low switching losses applications as shown by the inductive load switching turn-off waveform. Looking at applications such as medium power SMPS.

The MDmesh advantages of lower switching losses (because of lower intrinsic capacitance, shorter delay time, shorter crossover time and much smaller gate charge) and lower on-state losses due to the reduced RDS(on) result in significant improvements in system efficiency. The lower gate charge allows the use of smaller and more economic gate drive circuits.