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PowerFLAT MOSFETs
Advanced products in innovative leadless packages

After the recent introduction of the innovative leadless PowerFLAT package, ST is now expanding the range with more options. Besides the 5x5mm2 and 6x5mm2 versions already available, ST has just introduced the 3.3x3.3mm2 version.
An optimized leadframe that simplifies the soldering process for the 6x5mm2 is also being considered.
The PowerFLAT 6x5, with a larger frame than the standard SO-8, allows the reduction of on-resistance, breaking the 3mOhm barrier for a 20V device.
The advantage of this package is not only due to the improved figure-of-merit but also to a better thermal behaviour.


PowerFLAT 5x5 and 6x5 PowerFLAT MOSFETs
RTHJ-C = 1.56°C/W (6X5);
RTHJ-PCB = 31.2°C/W*
   (6x5, 5x5).

PowerFLAT 3.3x3.3
RTHJ-C = 2.5°C/W;
RTHJ-PCB = 80°C/W*.
*when mounted on FR-4 board, 2oz Cu,
t < 10s.

The improved thermal effects are also coupled together with other important features such as, height and weight reduction and an ultra thin profile for a very cost effective solution.


Typical Applications
All three versions of this package are suitable for applications where the power demand increases, and where space saving and good thermal performance are mandatory.

In particular telecom and datacom applications pose unique thermal challenges for DC-DC converters because of restrictive airflows caused by:
high component densities;
form-factor height;
elevated ambient temperatures.


PowerFLAT Product Range
A wide MOSFET product portfolio in PowerFLAT packages has been developed and covers voltage ranges from 20V to 650V.
Besides devices already in production, a new very low threshold device, for synchronous rectification has been developed.
The figure-of-merit of STL120NH02V is below 100mOhm*nC, and for the new STL8NH3LL in PowerFLAT 3.3x3.3 is even lower The dual island PowerFLAT 6x5 for isolated DC-DC converters is also under development for telecom applications.

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