AN926 Application note
Brand traceability
Introduction
To ensure traceability to specific assembly and test operations, ST clearly brands a date code on every device, as well as an encapsulation code on CAPHATTM products. STMicroelectronics is implementing a new marking and traceability scheme due to the sizes of the packages as well as increases in the number of fabrication, assembly, and test sites. The devices are marked with a trace code which provides for tracking the exact versions. The current device marking formats for our package options are shown in Figure 1 to 8. Table 1. Current packages and marking information
Package type QFN 8-lead SOIC and TSSOP 16-lead SOIC SOT 24-/28-pin CAPHATTM, 24-/44pin SOIC, 18-/28-pin SOX, and 32-/36-pin hybrid CAPHATTM encapsulation SNAPHAT Figure 1 2 3 4 Marking information 1-digit year, 2-digit work week 1-character assembly site, 1-digit year, 2-digit work week 2-digit assembly site, 1-digit year, 2-digit work week 3-digit part number, 1-digit work week 2-digit assembly site, 3-digit lot number, 2-digit wafer fab site 3-character country of origin, 2-digit test site, 1-digit year, 2-digit work week Assembly process, days, 1-digit year, working shift 2-digit assembly site, 3-digit lot number 7 3-character country of origin, 2-digit test site, 1-digit year, 2-digit work week 2-digit assembly site, 1-digit year, 2-digit work week, 3digit lot number
5
6
Shipping box traceability
8
February 2008
Rev 5
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www.st.com
New marking illustrations
AN9 2 6
New marking illustrations
Figure 1. QFN16 (3 x 3) package date code
1-digit Year (4 = 2004). 2-digit Work Week (01 - 52).
Y WW
Figure 2.
AI02442b
8-lead SOIC, QFN16 (4 x 4), DFN16 (5 x 4), and TSSOP date and assembly site code
Assembly site (9 = Muar, Z = Bouskoura, B = Amkor, N = UTAC, Y = CARSEM). 1-digit Year (4 = 2004). 2-digit Work Week (01 - 52).
P Y WW
AI02442c
Figure 3.
16-lead SOIC date and assembly site code
Assembly site (99 = Muar). 1-digit Year (4 = 2004). 2-digit Work Week (01 - 52).
PP Y WW
AI02442d
Figure 4.
SOT date and part number code
3-digit Part Number. 1-digit Work Week (A = WW01 - 02; B = WW03 - 04).
ZZZ W
Figure 5.
AI02442e
24-/28-pin CAPHATTM, 28-/44-pin SOIC, 18-/28-pin SOX, and 32-/36-pin hybrid code
Assembly site (99 = Muar, 77 = Cirtek, CB = Bouskoura-SPG, CZ = Bouskoura 2000). 3-digit Lot Number. 2-digit Wafer Fab Site (VH = Carrollton, VP = Phoenix).
PP LLL WX
Countr y of Origin (MYS = Malaysia, MAR = Morocco, PHL = Philippines). 2-digit Test Site (99 - Muar, CB = Bouskoura-SPG). 1-digit Year (4 = 2004); 2-digit Work Week (WW = 01).
COO TF YWW
AI02442f
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AN926 Figure 6. Encapsulation code (CAPHATTM only)
New marking illustrations
W = welded process X = number of days in year Y = 1-digit year (4 = 2004) Z = working shift
W XXX Y
Note:
Z
AI02443a
The 6-character encapsulation code (CAPHATTM only; Figure 6) is positioned at the end of the device and is placed perpendicularly to the date code. It summarizes details of the encapsulation process SNAPHAT
Figure 7.
Assembly site (99 = Muar). 3-digit Lot Number.
PP LLL
Countr y of Origin (MYS = Malaysia). 2-digit Test Site (99 - Muar). 1-digit Year (4 = 2004); 2-digit Work Week (WW = 01).
COO TF YWW
AI09666
Figure 8.
Shipping box traceability date code format
2-digit Assembly site (99 = Muar, 77 = Cirtek, 7B = Amkor ATP, 9Y = Carsem, CB = Bouskoura-SPG, CZ = Bouskoura 2000, FN = UTAC). 1-digit Year (4 = 2004). 2-digit Work Week (01 - 52). 3-digit Lot Number.
PP Y WW LLL
AI09647
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Previous (obsolete) marking information
AN926
Previous (obsolete) marking information
The 9-character date code (Figure 9) is positioned at the top of the label, beside the ST logo. This presents a complete facility identification, as well as a final-test time-line of the device's manufacturing process. The 7-character code (SOIC only; Figure 10) is positioned in the bottom line closest to Pin 1 on the device. It represents the lots' overall fabrication history. Figure 9. Date code
H 9 9 1 A 97 01
Wafer Fab Work Week Started Assembly 01, 05, 09 ... Assembly Site Year Started Assembly double digit: 97, 98, 99, 00, ... single digit: 1, 2, 3, ... Test Site Lot Designator 1A to 9Z
AI02442
Figure 10. Fab lot number
H925123
Wafer Fab
Individual Lot Numbers
Year Start Fabrication last digit of the year, single digit: 0, 1, 2, ...
Work Week Started Fabrication double digits: 01, 02, 03, ...
AI06379
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AN926 Figure 11. SNAPHAT
Previous (obsolete) marking information
H 9 9 1 A 97 01
Manufacturer Site Work Week Started Assembly 01, 05, 09 ... Assembly Site Year Started Assembly double digit: 97, 98, 99, 00, ... single digit: 1, 2, 3, ... Test Site Lot Designator 1A to 9Z
AI09667
Figure 12. Encapsulation code (CAPHATTM only)
A HT 1117 X
Assembly A: Automatic (machine) W: Welded process blank: Manual process
Test Temperature HT: 85 C blank: Standard test temp.
Julian Date (when Lot underwent Encapsulation process) e.g. 1117 = 111th day of 1997
Sequential Lot ID by Product Type
AI02443
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Contact information
AN926
Contact information
If you have any questions concerning matters raised in this document, please contact STMicroelectronics at the following address: http://www.st.com/stonline/domains/suppor t/contact_suppor t.htm
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Revision history
Revision history
Table 2.
Date Feb- 2002 26-Jul-2002 03-Feb-2003 14-Mar-2003 02-Jul-2004 26-Aug-2004 06-Jan-2004 15-Feb-2008
Document revision history
Revision 1.0 1.1 1.2 1.3 2.0 3.0 4.0 5.0 First issue. Updated date code (Figure 1). Updated date code, fab lot number (Figure 1, 10). Clarify lot number terminology (Figure 10) Reformatted; marking formats updated (Figure 1, 2, 3, 4, 5, 8) Updated (Figure 5, 8, 11; Table 1) Corrected figure title (Figure 5) Reformatted document; updated title, Table 1, Figure 1, 2, 6, 8, and technical support URL; moved Figure 12 to Previous (obsolete) marking information. Changes
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