L6420
2-Channel ultra low power GMR-TMR preamplifier for HDD applications
Data Brief
Feature summary
Flip Chip package 2-channel configuration Dual Power Supplies of +3V, +20% -10% and -2.1V, 6% Operating Temperature Range -25C to +85C Supports xGMR heads from 50 to 500 Ohms and perpendicular write heads Data Rate up to 600Mb/s Sleep mode power consumption < 200W Sleep-to-read recovery time < 500ns Read mode power consumption < 60mW (RMR=250Ohm, Ibias =400A, NF<2dB) Read Bandwidth (-3dB): 50kHz - 450MHz Read Gain selectable from 20dB to 38dB Write mode power consumption < 200 mW @ 600Mb/s measured with single head 100% Write mode duty cycle, 127b PRBS, Iw = 40mA, OSC = 100mA (0-pk), OSD = 500ps (PW50), with Heater off Write voltage launched up to 6V differential Accurate Flying Height Control using voltage or power output ESD diodes for MR head protection Differential Current and Voltage Bias / Voltage Sense architecture Bi-directional 16-bit serial interface 2.5V and 3.3V CMOS compatible
Flip Chip (Bumped die) This part is specially designed to have minimum dissipation in all the modes of operation (Sleep <200mW, Read <60mW, Write <200mW) and very fast Sleep to Read recovery time (S2R <500ns). It is designed for use with 2-terminal Giant Magneto Resistance / Tunnel Magneto Resistance read and Perpendicular write heads. In read mode, the device consists of a fully differential amplifier, offering: current or voltage bias, voltage-sense input, programmable input impedance, a wide-range read gain, low-noise and high-bandwidth. In write mode, it includes fast current switching differential write drivers, which support data rates up to 600 Mb/s, overshoot amplitude and duration programmability. In all the modes of operations Fly Height Control circuit is available. This circuit delivers an accurate programmable voltage or power to a resistive element near the write head to match write current induced heating and subsequent expansion or protrusion of the pole tip which effect the media spacing.
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Description
The L6420 is a BICMOS Silicon Germanium monolithic integrated circuit differential preamplifier for Ultra Low Power Hard Disk Drive applications.
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The part is further comprehensive of an extensive analog/digital measurement scheme for the read, write, heater heads and die temperature, of an extensive fault detection and reporting scheme, thermal asperity detection and correction, write degauss function..
Order code
Part number L6420 Package Flip Chip (Bumped die) Operating temp. range -25C to +85C
July 2006
Rev 1
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For further information contact your local STMicroelectronics sales office.
Revision history
L6420
1
Revision history
Table 1.
Date 12-Jul-2006
Document revision history
Revision 1 Initial release. Changes
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L6420
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