VX6852
QXGA EDOF camera module
Data Brief
Features
3.15 megapixel resolution sensor (2048 x 1536) Extended Depth of Field (EDOF) High quality lens Compact size: 6.5 mm x 6.5 mm x 4.6 mm Video data interface - CCP2.0 Command interface - CCI Analog power supply from 2.4 V to 2.9 V Digital power supply from 1.7 V to 1.9 V On-board 10 bit ADC Integral EMC shielding and EMI reduction techniques Ultra low power standby mode Analog Binning (2x2) for higher image quality in video mode RoHS (lead-free) package
A separate hardware accelerator (STV0986) or application engine (STn8815) device can be incorporated in the phone system to run the associated image processing algorithms in hardware where the baseband cannot support this processing load. The specifications of these devices are contained in a separate document. Figure 1. VX6852 block diagram
VX6852
EXTCLK XSHUTDOWN PLL and Clock Management Power Mgmt CCI Receiver Sensor Control Registers Power-On Reset 3.15 Mpixel Pixel array 1152 x 864 VDIG DGND
SCL SDA CLKP CLKN DATAP DATAN
CCP2.0 Transmitter
Readout
Frame formatter
Y Decoder
VANA AGND
Column ADC X Decoder Line SRAM
Description
This data brief outlines a high performance 3.15 megapixel EDOF camera module (VX6852) for use across a range of mobile phone handsets and accessories. It is designed to be used for high quality still camera functions and also supports low power video modes. The product can output raw bayer 3 Mpixel images at up to 20 fps. The module design is optimized for both footprint and height. The module is always in focus from 30 cm to infinity. All components are integrated inside the camera module, with the exception of two CCI pull-up resistors and a de-coupling capacitor. VX6852 offers an ultra low power consumption hardware standby mode consuming less than 30 W (typ.).
Figure 2.
VX6852 3.15 MP camera module
VX6852 application diagram
STV0986 processor Baseband or Application Processor
CLK PDN C CI CCP2.0
CLK PDN I2C CCP2.0 or ITU
VX6852 3.15 MP camera module
CL K PDN CCI CCP2.0
Baseband or Application Processor Rx'e r
May 2008
Rev 3
1 /4
www.st.com
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For further information contact your local STMicroelectronics sales office.
Technical specifications
VX6852
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Technical specifications
Table 1. Technical specifications
Parameter Pixel resolution Sensor technology Pixel size Exposure control Analogue gain Digital gain Dynamic range Signal to noise Supply voltages Average power consumption Package size (lxwxh) Lens TV distortion Relative illumination System attach 2048 x 1536 (QXGA) ST IMG175 process 1.75 m x 1.75 m + 81 dB + 24 dB (max) + 6 dB (max) 60 dB 36 dB (@ 100 lux) Analogue: 2.4 V to 2.9 V Digital: 1.7 V to 1.9 V <200 mW (Viewfinder mode) <460 mW (Capture mode) 6.5 mm x 6.5 mm x 4.6 mm 58 +/-2 HFOV F/2.6 <-0.28%, <+0.5% 40 % (typ.) SMIA65 socket Description
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Ordering information
Table 2. Ordering information
Package SMIA65 for socket attachment Packing Tape and reel
Order code VX6852Q038/T2(1)
1. ECOPACK package
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VX6852
Revision history
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Revision history
Table 3.
Date 07-Feb-2008
Document revision history
Revision 1 Initial release. Corrected the digital supply voltage maximum value in Features and Table 1: Technical specifications. Corrected the TV distortion minimum value and the relative illumination value in Table 1: Technical specifications. Updated the second paragraph of the Description. Removed references to SMIA standard. Changed the F# in Table 1: Technical specifications. Changes
11-Feb-2008
2
22-May-2008
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VX6852
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