STTH3R06
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics IF(AV) VRRM IR (max) Tj VF (typ) trr (typ) FEATURES AND BENEFITS
3A 600 V 100 A 175C 1.0 V 35 ns
A
K
Ultrafast switching Low forward voltage drop Low thermal resistance Low leakage current (platinium doping)
DO-201AD STTH3R06
DESCRIPTION The STTH3R06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, inverters and as a free wheeling diode. SMB STTH3R06U SMC STTH3R06S
Table 2: Order Codes Part Number STTH3R06 STTH3R06RL STTH3R06U STTH3R06S Marking STTH3R06 STTH3R06 3R6U R6S
September 2005
REV. 3
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Table 3: Absolute Ratings (limiting values) Symbol V RR M IF(RMS) IF(AV) RMS forward current Average forward current = 0.5 Surge non repetitive forward current Storage temperature range Maximum operating junction temperature DO-201AD SMB SMC IFSM Tstg Tj DO-201AD SMB / SMC Tl = 80C Tl = 55C Tl = 80C tp = 10ms sinusoidal 55 45 -65 to + 175 175 C C A Parameter Repetitive peak reverse voltage Value 600 10 3 Unit V A A
Table 4: Thermal Parameters Symbol Rth(j-l) Junction to lead Parameter DO-201AD SMB SMC Rth(j-a) Junction to ambient (see fig. 13) DO-201AD L = 10 mm L = 10 mm Maximum 20 25 20 75 C/W Un i t C/W
Table 5: Static Electrical Characteristics Symbol IR Parameter Reverse leakage current Test conditions Tj = 25C Tj = 150C VF Forward voltage drop Tj = 25C Tj = 150C
To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF (RMS)
Min.
Typ
Max. 3
Unit A
VR = VRRM 15 IF = 3A 1.0
2
100 1.7 1.25 V
Table 6: Dynamic Characteristics Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25C Tj = 25C Test conditions IF = 0.5A IRR = 0.25A IR = 1A IF = 1A dIF/dt = -50 A/s VR =30V IF = 3A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 3A dIF/dt = 100 A/s 35 100 10 ns V Min. Typ Max. Unit 30 ns
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Figure 1: Conduction losses versus average current
P(W)
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 50
Figure 2: Forward voltage drop versus forward current
IFM(A)
= 0.05
= 0.1 = 0.2
= 0.5 =1
45 40 35 30 25 20
Tj=150C (typical values) Tj=25C (maximum values) Tj=150C (maximum values)
T
15 10
IF(AV)(A)
=tp/T
tp
5 0 0.0 0.5 1.0 1.5
VFM(V)
2.0 2.5 3.0 3.5 4.0
Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, Lleads = 10mm, SCU=1cm2)
Zth(j-a)/Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMC SCu = 1cm2 SMB SCu = 1cm2
Single pulse
Figure 4: Peak reverse recovery current v e r s u s dI F / d t (typical values)
IRM(A)
13 12 11 10 9 8 7 6 5
IF=0.25 x IF(AV) IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV)
DO-201AD Lleads = 10mm
4 3 2
tp(s)
1 0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
Figure 5: Reverse recovery time versus dIF/dt ( t y p i c a l values)
trr(ns)
160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0 50 100
Figure 6: Reverse recovery charges versus dIF/dt (typical values)
Qrr(nC)
450
VR=400V Tj=125C IF=2 x IF(AV)
VR=400V Tj=125C
400 350 300
IF=2 x IF(AV)
IF=IF(AV)
IF=0.5 x IF(AV)
250 200
IF=IF(AV)
IF=0.5 x IF(AV)
150 100 50
dIF/dt(A/s)
0
150 200 250 300 350 400 450 500
dIF/dt(A/s)
0 50 100 150 200 250 300 350 400 450 500
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Figure 7: Softness factor versus dIF/dt (typical values)
S factor
3.0
IF=IF(AV) VR=400V Tj=125C
Figure 8: Relative variations of dynamic parameters versus junction temperature
1.0 0.9 0.8 0.7
IRM
S factor
2.5
2.0
0.6 0.5 0.4
QRR
1.5
1.0
0.3 0.2
IF=IF(AV) VR=400V Reference: Tj=125C
0.5
0.1
Tj(C)
25 50 75 100 125
0.0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
0.0
Figure 9: Transient peak forward voltage versus dIF/dt (typical values)
VFP(V)
20 18 16 14 12 10 8 6 4 2 0 0 20 40 60 80 100 120 140 160 180 200
IF=IF(AV) Tj=125C
Figure 10: Forward recovery time versus dIF/dt (typical values)
tfr(ns)
200 180 160 140 120 100 80 60 40
IF=IF(AV) VFR=1.1 x VF max. Tj=125C
dIF/dt(A/s)
20 0 0 20 40 60
dIF/dt(A/s)
80 100 120 140 160 180 200
Figure 11: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
100
F=1MHz VOSC=30mVRMS Tj=25C
Figure 12: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35m) (DO-201AD)
Rth(j-a)(C/W)
80 70 60
DO-201AD
50 10 40 30 20 10
VR(V)
1 1 10 100 1000 0 0 1 2 3 4
SCU(cm²)
5 6 7 8 9 10
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Figure 13: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35m) (SMB / SMC)
Rth(j-a)(C/W)
110 100 90 80
SMB
Figure 14: Thermal resistance versus lead length
Rth(C/W)
100
DO-201AD
90 80 70 60
SMC Rth(j-a)
70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
50 40
Rth(j-l)
30 20
SCU(cm²)
10 0 5 10
Llead(mm)
15 20 25
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Figure 15: SMB Package Mechanical Data DIMENSIONS
E1
REF.
Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
Figure 16: SMB Foot Print Dimensions (in millimeters)
2.3
1.52
2.75
1.52
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Figure 17: SMC Package Mechanical Data DIMENSIONS REF.
E1
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A1
D
1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
A2 b c
E
E
A1
E1 E2
b
C L
A2
D L
Figure 18: SMC Foot Print Dimensions (in millimeters)
3.3
2.0
4.2
2.0
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Figure 19: DO-201AD Package Mechanical Data
DIMENSIONS
B A B ØC
REF.
Millimeters Min. Max. 9.50 25.40 5.30 1.30 1.25 Min.
Inches Max. 0.374 1.000 0.209 0.051 0.049
note 1
E
E
note 1
ØD
ØD
A B C D E
note 2
1 - The lead diameter ø D is not controlled over zone E within the device NOTES 2 - The minimum axial lengthbent at whichangles is may be placed with its leads right 0.59"(15 mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 7: Ordering Information Ordering type STTH3R06 STTH3R06-RL STTH3R06U STTH3R06S
Marking STTH3R06 STTH3R06 3R6U R6S
Package DO-201AD DO-201AD SMB SMC
Weight 1.12 g 1.12 g 0.11 g 0.243 g
Base qty 600 1900 2500 2500
Delivery mode Ammopack Tape & reel Tape & reel Tape & reel
Epoxy meets UL94, V0 Band indicated cathode (DO-201AD) Bending method: see application note AN1471 (DO-201AD)
Table 8: Revision History Date March-2003 07-Sep-2004 14-Oct-2005 Revision 1 2 3 First issue SMB and SMC packages added Changed marking of STTH3R06U from R06U to 3R6U on page 1. Added ECOPACK statement. Description of Changes
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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