M3004LD
REMOTE CONTROL TRANSMITTER
FEATURES SUMMARY FLASHED OR MODULATED TRANSMISSION
Figure 1. Package
7 SUB-SYSTEM ADDRESSES UP TO 64 COMMANDS PER SUB-SYSTEM ADDRESS HIGH-CURRENT REMOTE OUTPUT AT VDD = 6V (IOH = 80mA) LOW NUMBER OF ADDITIONAL COMPONENTS KEY RELEASE DETECTION BY TOGGLE BITS VERY LOW STAND-BY CURRENT (< 2A) OPERATIONAL CURRENT < 1mA AT 6V SUPPLY SUPPLY VOLTAGE RANGE 2 TO 6.5V CERAMIC RESONATOR CONTROLLED FREQUENCY (typ. 450kHz)
REMO
1 2 3 4 5 6 7 8 9 10 20 19
SO20 (Plastic Package)
Figure 2. Pin Connection
VDD DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N OSC OUT OSC IN
DESCRIPTION The M3004LD transmitter IC is designed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button, a slider switch or hard wired. The M3004LD generates the pattern for driving the output stage. These patterns are pulse distance coded. The pulses are infrared flashes or modulated. The transmission mode is defined in conjunction with the sub-system address. Modulated pulses allow receivers with narrow-band preamplifiers for improved noise rejection to be used. Flashed pulses require a wide-band preamplifier within the receiver.
SEN 6N SEN 5N SEN 4N SEN 3N SEN 2N SEN 1N SEN 0N ADRM VSS
18
17 16 15 14
13
12 11
REV. 2 June 2004 1/14
M3004LD
Figure 3. Block Diagram
DRV OUTPUTS 0N 1N 2N 3N 4N 5N 6N S E N I N P U T S 0N 1N 2N 3N 4N 5N 6N ADRM VDD VSS OSCI OSCO OSCILLATOR CONTROL LOGIC KEYBOARD SCAN PULSE DISTANCE MODULATOR REMO OUTPUT
INPUTS AND OUTPUTS Key matrix inputs and outputs (DRV0N to DRV6N and SEN0N to SEN6N) The transmitter keyboard is arranged as a scanned matrix. The matrix consists of 7 driver outputs and 7 sense inputs as shown in Figure 4. The driver outputs DRV0N to DRV6N are open drain N-channel transistors and they are conductive in the stand-by mode. The 7 sense inputs (SEN0N to SEN6N) enable the generation of 56 command codes. With 2 external diodes all 64 commands are addressable. The sense inputs have P-channel pull-up transistors so that they are HIGH until they are pulled LOW by connecting them to an output via a key depression to initiate a code transmission. ADDRESS MODE INPUT (ADRM) The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver outputs (DRV0N to DRV6N) of the key matrix. If more than one driver is connected to ADRM, they must be decoupled by diodes. This allows the definition of seven subsystem addresses as shown in Table 3. If driver DRV6N is connected to ADRM, the data output
format of REMO is modulated or if not connected, flashed. The ADRM input has switched pull-up and pulldown loads. In the stand-by mode only the pulldown device is active. Whether ADRM is open (sub-system address 0, flashed mode) or connected to the driver outputs, this input is LOW and will not cause unwanted dissipation. When the transmitter becomes active by pressing a key, the pulldown device is switched off and the pull-up device is switched on, so that the applied driver signals are sensed for the decoding of the sub-system address and the mode of transmission. The arrangement of the sub-system address coding is such that only the driver DRVnM with the highest number (n) defines the sub-system address, e.g. if drivers DRV2N and DRV4N are connected to ADRM, only DRV4N will define the subsystem address. This option can be used in systems requiring more than one sub-system address. The transmitter may be hard-wired for subsystem address 2 by connecting DRV1N to ADRM. If now DRV3N is added to ADRM by a key or a switch, the transmitted sub-system address changes to 4. A change of the sub-system address will not start a transmission.
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REMOTE CONTROL SIGNAL OUTPUT (REMO) The REMO signal output stage is a push-pull type. In the HIGH state, a bipolar emitter-follower allows a high output current. The timing of the data output format is listed in Table 1 and 2. The information is defined by the distance tb between the leading edges of the flashed pulses or the first edge of the modulated pulses (see Figure 6). The format of the output data is given in Figure 5 and 6. The data word starts with two toggle bits T1 and T0, followed by three bits for defining the sub-system address S2, S1 and S0, and six bits F, E, D, C, Band A which are defined by the selected key. In the modulated transmission mode the first toggle bit is replaced by a constant reference time bit (REF). This can be used as a reference time for the decoding sequence. The toggle bits function is an indication for the decoder that the next instruction has to be considered as a new command. The codes for the sub-system address and the selected key are given in Table 3 and 4. The REMO output is protected against "Lock-up", i.e. the length of an output pulse is limited to <1ms, even if the oscillator stops during an output pulse. This avoids the rapid discharge of the battery that would otherwise be caused by the continuous activation of the LED. OSCILLATOR INPUT / OUTPUT (OSCI and OSCO) The external components must be connected to these pins when using an oscillator with a ceramic resonator. The oscillator frequency may vary between 350kHz and 600kHz as defined by the resonator. FUNCTIONAL DESCRIPTION Keyboard operation In the stand-by mode all drivers (DRV0N to DRV6N) are on (low impedance to VSS). When ever a key is pressed, one or more of the sense inputs (SENnN) are tied to ground. This will start the power-up sequence. First the oscillator is activated and after the debounce time tDB (see Figure 7) the output drivers (DRV0N to DRV6N) become active successively. Within the first scan cycle the transmission mode, the applied sub-system address and the selected command code are sensed and loaded into an internal data latch. In contrast to the command code, the sub-system is sensed only within the first scan cycle. If the applied sub-system address is changed while the command key is pressed, the transmitted sub-system address is not altered. In a multiple key stroke sequence (see Figure 8) the command code is always altered in accordance with the sensed key. MULTIPLE KEY-STROKE PROTECTION The keyboard is protected against multiple keystrokes. If more than one key is pressed at the same time, the circuit will not generate a new output at REMO (see Figure 8). In case of a multiple key-stroke, the scan repetition rate is increased to detect the release of a key as soon as possible. There are two restrictions caused by the special structure of the keyboard matrix: The keys switching to ground (code numbers 7, 15, 23, 31, 39, 47, 55 and 63) and the keys connectedto SEN5N and SEN6N are not covered completely by the multiple key protection. If one sense input is switched to ground,further keys on the same sense line are ignored, i.e. the command code corresponding to "key to ground" is transmitted. SEN5N and SEN6N are not protected against multiple keystroke on the same driver line, because this condition has been used for the definition of additional codes (code number 56 to 63). OUTPUT SEQUENCE (data format) The output operation will start when the selected code is found. A burst of pulses, including the latched address and command codes, is generated at the output REMO as long as a key is pressed. The format of the output pulse train is given in Figure 5 and 6. The operation is terminated by releasing the key or if more than one key is pressed at the same time. Once a sequence is started, the transmitted data words will always be completed after the key is released. The toggle bits T0 and T1 are incremented if the key is released for a minimum time tREL (see Figure 7). The toggle bits remain unchanged within a multiple key-stroke sequence.
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Table 1. Pulse Train Timing
Mode Flashed Modulated TO (ms) 2.53 2.53 tP (s) 8.8 tM (s) 26.4 tML (s) 17.6 tMH (s) 8.8 tW (ms) 121 121
fOSC tP tM t ML t MH tW TO
455kHz 4 x tOSC 12 x tOSC 8 x tOSC 4 x tOSC 55296 x tOSC 1152 x t OSCb
tOSC = 2.2ms Flashed Pulse Width Modulation Period Modulation Period Low Modulation Period High Word Distance Basic Unit of Pulse Distance
Note: The following number of pulses may be selected by Metal option: N= 8, 12, 16. The different dividing ratio for TO and tW between flash mode and carrier mode is obtained by changing the modulo of a particular divider from divide by 3 during flash mode to divide by 4 during carrier mode. This allows the use of a 600kHz ceramic resonator during carrier mode to obtain a better noise immunity for the receiver without a significant change in TO and tW. For first samples, the correct divider ration is obtained by a metal mask option. For final parts, this is automatically done together with the selection of flash-/carrier mode.
Table 2. Pulse Train Separation (tb)
Code Logic "0" Logic "1" Toggle Bit Time Reference Time tb 2 x TO 3 x TO 2 x TO or 3 x TO 3 x TO
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Table 3. Transmission Mode and Sub-system Adress Selection
Sub-system Address Mode # F L A S H E D M O D U L A T E D 0 1 2 3 4 5 6 0 1 2 3 4 5 6 S2 1 0 0 0 0 1 1 1 0 0 0 0 1 1 S1 1 0 0 1 1 0 0 1 0 0 1 1 0 0 S0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 O X X X X X 1 2 3 4 5 6 Driver DRVnN for n =
O X X X X
O X X X
O X X
O X
O
O X X X X X
O X X X X
O X X X
O X X
O X
O
O O O O O O
Note: O = connected to ADRM blank = not connected to ADRM X = don't care
Table 4. Key codes
Code Matrix Drive DRV0N DRV1N DRV2N DRV3N DRV4N DRV5N DRV6N VSS Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Matrix Sense F SE N0N SE N0N SE N0N SE N0N SE N0N SE N0N SE N0N SE N0N SE N1N SE N2N SE N3N SE N4N SE N5N SE N6N SEN5N and SEN6N 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 E 0 0 0 0 0 0 0 0 0 1 1 0 0 1 1 D 0 0 0 0 0 0 0 0 1 0 1 0 1 0 1 C 0 0 0 0 1 1 1 1 B 0 0 1 1 0 0 1 1 Note 2 Note 2 Note 2 Note 2 Note 2 Note 1 Note 2 A 0 1 0 1 0 1 0 1 0 1 2 3 4 5 6 7 8 to 15 16 to 23 24 to 31 32 to 39 40 to 47 48 to 55 56 to 63 Matrix Position
Note: 1. The complete matrix drive as shown above for SEN0N is also applicable for the matrix sense inputs SEN1N to SEN6N and the combined SEN5/SEN6N. 2. The C, B and A codes are identical to SEN0N as given above.
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Table 5. Absolute Maximum Ratings (Tcase = 25C)
Symbol VDD VI VO I I (REMO) M PTOT TSTG TA Supply Voltage Range Input Voltage Range Output Voltage Range D.C. Current into Any Input or Output Peak REMO Output Current during 10s, Duty Factor = 1% Power Dissipation per Package for TA = 20 to +70C Storage Temperature Range Operating Ambient Temperature Range Parameter Value 0.3 to +7 0.3 to (VDD + 0.3) 0.3 to (VDD + 0.3) Max 10 Max 300 Max 200 55 to +125 20 to +70 Unit V V V mA mA mW C C
Note: Stresses in excess of those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions in excess of those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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ELECTRICAL CHARACTERISTICS VSS = 0V, TA = 25C (unless otherwise specified) Table 6.
Symbol VDD IDD Parameter Supply Voltage Supply Current Test Conditions TA = 0 to +70C · Active fOSC = 455kHz REMO, Output unload · Inactive (stand-by mode) fOSC VIL VIH II II VOL IO VIL VIH IIL Oscill. Frequency Input Voltage Low Input Voltage High Input Current Input Leakage Current Output Voltage "ON" Output Current "OFF" Input Voltage Low Input Voltage High Input Current Low (switched P and N channel pull-up/pull down) Input Current High (switched P and N channel pull-up/pull down) Output Current High Output Current Low Pulse Length Input Current Output Voltage high Output Voltage Low Pull-up Act. Oper. Condition, VIN = VSS VDD = 2V VDD = 6.5V Pull-down Act. Stand-by Cond.,VIN = VDD VDD = 2V VDD = 6.5V 0.7 x VDD 10 100 100 600 KEYBOARD MATRIX - Inputs SE0N to SEN6N VDD = 2 to 6.5V VDD = 2 to 6.5V VDD = 2V, VI = 0V VDD = 6.5V, VI = 0V VDD = 6.5V, VI = VDD VDD = 2V, IO = 0.1mA VDD = 6.5V, IO = 2.5mA VDD = 6.5V, VO = 11V 0.7 x VDD 10 100 100 600 1 0.3 0.6 10 0.3 x VDD 0.3 x VDD V V A A A V V A V V A A VDD = 3V VDD = 6V VDD = 6V 350 Min 2 0.25 1.0 Typ Max 6.5 0.5 2 2 600 Unit V mA mA A kHz
VDD = 2 to 6.5V (cer resonator)
KEYBOARD MATRIX - Outputs DRV0N to DRV6N
CONTROL INPUT ADRM
IIH
10 100
100 600
A A
DATA OUTPUT REMO IOH IOL tOH II VOH VOL VDD = 2V, VOH = 0.8V VDD = 6.5V, VOH = 5V VDD = 2V, VOL = 0.4V VDD = 6.5V, VOL = 0.4V VDD = 6.5V, Oscill. Stopped VDD = 2V VDD = 6.5V, OSC1 at VDD VDD = 6.5V, IOL = 0.1mA VDD = 6.5V, IOH = 0.1mA 5 VDD 0.8 0 .7 60 80 0.6 0.6 1 5 7 mA mA mA mA ms A A V V
OSCILLATOR
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Figure 4. Typical Application
Figure 5. Data Format of REMO Output
Note: REF = Reference Time; T0 and T1 = Toggle bits; S0, S1 and S2 = System address; A, B, C, D, E and F = Command bits. (a) flashed mode: transmission with 2 toggle bits and 3 address bits, followed by 6 command bits (pulses are flashed) (b) modulated mode: transmission with reference time, 1 toggle bit and 3 address bits, followed by 6 command bits (pulses are modulated)
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Figure 6. REMO Output Waveform
Note: (a) flashed pulse (b) modulated pulse [tPW = (5 x tM) + tMH)]
Figure 7. Single Key - Stroke Sequence
Note: Debounce time: tDB = 4 to 9 x TO Start time: tST = 5 to 10 x TO Minimum release time: tREL = TO
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Figure 8. Multiple Key-Stroke Sequence
Note: Scan rate multiple key-stroke : tSM = 8 to 10 x TO
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PART NUMBERING Table 7. Order Codes
Order Codes M3004LD M 3004LDT Pa c k a g e SO20 SO 2 0 Operative Temperature Range 20 to +70C 20 to +70C
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PACKAGE MECHANICAL Table 8. 20 PINS - PLASTIC MICROPACKAGE Mechanical Data
Symbol A a1 a2 b b1 C c1 D E e e3 F L M S 7 .4 0 .5 12.6 10 1.27 11.43 7.6 1.27 0.75 8 (Max) 0 .291 0.020 13.0 10.65 0.35 0.23 0 .5 45 (Typ) 0.496 0.394 0.050 0.450 0.300 0.050 0.030 0.510 0.419 0.1 millimeters Min Typ Max 2.65 0 .2 2.45 0.49 0.32 0.014 0.009 0.020 0.004 Min inches Typ Ma x 0.104 0.008 0.096 0.019 0.013
Figure 9. Package Dimensions
Note: Drawing is not to scale.
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REVISION HISTORY Table 9. Revision History
Date November-1992 28-June-2004 Revision 1 2 First Issue Stylesheet update. No content change. Description of Changes
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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