SD2942
RF Power Transistors HF/VHF/UHF N - Channel MOSFETs
General Features
GOLD METALLIZATION EXCELLENT THERMAL STABILITY COMMON SOURCE CONFIGURATION, PUSH PULL POUT = 350W MIN. WITH 15dB GAIN @ 175MHz LOW R DS(on)
M244 Epoxy sealed
Pin Connection Description
The SD2942 is a gold metallized N-Channel MOS field-effect RF power transistor. The SD2942 offers 25% lower R ds(ON) than industry standard and 20% higher power saturation than ST SD 2932. These characteristics make the SD2942 ideal for 50V DC very high power application up to 250 MHz. 1 1
3 1. Drain 2. Gate 3. Source 2 2
3
Order Codes
Part Number SD2942 M arking SD 2942 Package M2 4 4 Packaging Plastic Tray
January 2006
Rev 2 1/14
www.st .com 14
SD2942
Contents
1 Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1 .1 1 .2 1 .3 Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical Characteristics (TCASE = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 3 4 5 6
Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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SD2942
1 Electrical Data
1
1.1
Table 1.
Electrical Data
Maximum Rating
Absolute Maximum Rating (TCASE = 25C)
Symbol V(BR)DSS(1) VDGR(1) VGS ID PDISS TJ TSTG
1. TJ = 150 C
Parameter D rain Source Voltage D rain-G ate Voltage (RGS = 1M) G ate-Source Voltage D rain Current Power Dissipation M ax. Operating Junction Temperature Storage Temperature
Value 130 130 20 40 500 +200 -65 to +150
Unit V V V A W C C
1.2
Table 2.
Thermal Data
Thermal data
Parameter Junction to Case thermal resistance Value 0.35 Uni t C/W
Symbol RthJC
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1 Electrical Data
SD2942
1.3
Table 3.
Electrical Characteristics (TCASE = 25C)
Static (per section)
Test Conditions VGS = 0 V VGS = 0 V VGS = 20 V VDS = 10 V VGS = 10 V VDS = 10 V VGS = 0 V VGS = 0 V VGS = 0 V IDS = 100 mA VDS = 50 V VDS = 0 V ID = 250 mA ID = 10 A ID = 5 A VDS = 50 V VDS = 50 V VDS = 50 V f = 1 MHz f = 1 MHz f = 1 MHz 5 415 236 17 1.5 Min. 130 100 250 4 3.0 Typ. Ma x . Uni t V A nA V V m ho pF pF pF
S y mb o l V(BR)DSS(1) IDSS IGSS VGS(Q) VDS(ON) GF S CISS COSS CRSS
1. TJ = 150C
Table 4.
S y mb o l POUT G PS D Load Mismatch
Dynamic
Test Conditions VDD = 50 V VDD = 50 V VDD = 50 V VDD = 50 V IDQ = 500 mA IDQ = 500 mA POUT = 350 W IDQ = 500 mA POUT = 350 W IDQ = 500 mA POUT = 350 W f = 175MHz f = 175MHz f = 175MHz f = 175MHz Min. 350 15 55 5:1 17 61 Typ. Ma x . Unit W dB % V S WR
All Phase Angles
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SD2942
2 Impedance
2
Figure 1.
Impedance
Impedance Data Schematic
D ZDL
Typical Input Impedance
Typical Drain Load Impedance
G ZI N
S
Table 5.
f
Impedance Data
ZIN () 1.3 - j 1.9 1.2 - j 1.8 1.1 - j 1.6 1.0 - j 1.4 1.8 - j 2.5 3.2 - j 4.4 ZDL () 1.9 + j 3.2 2.1 + j 3.7 2.7 +j 4.2 3.3 + j 4.8 7.5 + j 9 10 + j 12
250 MHz 230 MHz 200 MHz 175 MHz 100 MHz 50 MHz
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3 Typical Performance
SD2942
3
Typical Performance
Figure 2.
1000
Capacitance Vs Drain Voltage
CISS
Figure 3.
20 18 16
Drain Current Vs Gate Voltage
Vds = 10 V
C O SS Capac itance (pF) 100
14 12 Id (A) 10 8 6
Freq = 1 MHz
C RSS 10
4 2 Tc = +80 C Tc = +25 C Tc = -20 C 0
1 0 5 10 15 20 25 30 35 40 45 50 55 Vdd (V)
0
1
2
3 Vgs (V)
4
5
6
Figure 4.
1.15
Gate Source Voltage Vs Case Temp. Figure 5.
100
Safe Operating Area
1.10
Vgs (V - Normalized)
1.05
Id = 11 A Id = 10 A
1.00
Id = 7 A Id = 9 A
Id s (A)
Id = 5 A
0.95
10
Id = 4 A Id = 2 A Id = 1 A
0.90
0.85
Id = 0.25 A Id = 0.1 A
0.80 -25 0 25 Tc ( C)
o
1
50 75 100
1
10 Vds (V)
100
1000
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SD2942
Figure 6.
20 19 18 17 G ain (dB) 16 15 +80C 14 13 12 0 50 100 150 200 250 P out (W) 300 350 400 450 500 Vdd = 50V Idq = 2 x 250mA Freq = 175 MHz
10 20
3 Typical Performance
Power Gain Vs Pout and Case Temp. Figure 7.
70
Efficiency Vs Pout and Case Temp.
+ 25C 60 -20C
-20C
50
+ 80C
+25C
Nd (%)
40
30
Vdd = 50V Idq = 2 x 250mA Freq = 175 MHz 0 50 100 150 200 250 300 Pout (W) 350 400 450 500
0
Figure 8.
Pout Vs Input Power and Case Temp Figure 9.
Pout Vs Input Power & Drain Voltage
500 450 400 350 Pout (W) 300 250 200 150 100 50 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 P in (W) Vdd = 50V Idq = 2 x 250mA Freq = 175 MHz -20C + 25C + 80C
Pout (W)
500 450 50V 400 350 300 250 200 150 100 50 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Pin (W) Freq = 175 MHz Idq = 2 x 250mA 40V
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3 Typical Performance
SD2942
Figure 10. Pout Vs Gate Voltage & Case Temp. Figure 11. Pout Vs Drain Voltage & Input Power
500 450 400 350 Pout (W) 300 - 20C
500 Pin = 10W 450 400
+ 25C
350 Pout (W) Pin = 7W 300 250
250 200 150 100 50 0 -4 -3 -2 -1 0 Vgs (V) 1 2
+ 80C
Pin = 5W
200
Freq = 175 MHz Idq = 2 x 250mA P in = 7W 3 4
150 100 24 28 32 36 Vdd (V) 40
Freq = 175 MHz Idq = 2 x 250mA 44 48 52
Figure 12. Max. Therm. Resist Vs Case Temp.
0.42
0.40
Rth( j-c ) ( C/W)
o
0.38
0.36
0.34 25 30 35 40 45 50 55 Tc ( C)
o
60
65
70
75
80
85
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SD2942
4 Test Circuit
4
Test Circuit
Figure 13. 175 MHz Test Circuit Schematic
Note: 1 D imension at component symbol are reference for component placement. 2 Gap between ground and transmission lines is + 0.002{0.05} - 0.000{0.00} Typ.
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4 Test Circuit
SD2942
175 MHz Test Circuit Component Part List
S y mb o l Description 470 1 W, Surface Mount Chip Resistor 360 0.5 W, Carbon Comp. Axial Lead Resistor or Equivalent 560 2 W, Resistor Two Turn Wire Air-Wound Axial Lead Resistor 20 K 3.09 W, 10 Turn Wirewound Precision Potentiometer 680 pF ATC 130B Surface Mount Ceramic Chip Capacitor 10000 pF ATC 200B Surface Mount Ceramic Chip Capacitor 75 pF ATC 100B Surface Mount Ceramic Chip Capacitor ST40 25 pF - 115 pF Miniature variable Trimmer 47 pF ATC 100B Surface Mount Ceramic Chip Capacitor 43 pF ATC 100B Surface Mount Ceramic Chip Capacitor 1200 pF ATC 700B Surface Mount Ceramic Chip Capacitor 470 pF ATC 700B Surface Mount Ceramic Chip Capacitor 0.1 F / 500 V Surface Mount Ceramic Chip Capacitor 0.01 F / 500 V Surface Mount Ceramic Chip Capacitor 10 F / 63 Aluminum Electrolytic Axial Lead Capacitor 50 RG316 O.D 0.076[1.93] L = 11.80[299.72] Flexible Coaxial Cable 4 Turns thru Fair-rite Bead 50 RG-142B O.D 0.165[4.19] L = 11.80[299.72] Flexible Coaxial Cable R.F. Transformer 4:1, 25 O.D RG316-25 O.D 0.080[2.03] L = 5.90[149.86] Flexible Coaxial Cable 2 Turns thru Fair-rite Multi-Aperture Core R.F. Transformer 1:4, 25 Semi-rigid Coaxial Cable O.D. 0.141[3.58] L = 5.90[149.86] Inductor 1/4 Wave 50 O.D 0.165[4.19] L = 11.80 [299.72] Flexible Coaxial Cable 2 Turns thru Fair-rite Bead Shield Bead Multi-aperture Core Multilayer Ferrite Chip Bead (Surface Mount) Surface Mount Emi Shield Bead Woven Glass Reinforced PTFE Microwave Laminate 0.06", 1 oz EDCu, Both sides, r = 2.55
Table 6.
R1,R2,R5,R6 R3,R4 R7,R8 R9,R10 C1,C4 C2,C3,C7,C8,C17,C19,C20,C21 C5 C6 C9,C10 C11,C12, C13 C14,C15,C24,C25 C16,C18 C22,C23 C26,C27 C28 B1 B2 T1 T2 L1 FB1,FB5 FB2,FB6 FB3 FB4 PCB
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SD2942
Figure 14. 175 MHz Test Circuit Photomaster
4 Test Circuit
8.50 inches
Figure 15. 175 MHz Test Circuit
4 inches
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5 Mechanical Data
SD2942
5
Table 7.
DIM.
Mechanical Data
M244 (.400 x .860 4/L BAL N/HERM W/FLG)
m m. MIN. A B C D E F G H I J K L M N 33.91 0.10 1.52 2.59 4.83 10.03 21.59 3.02 9.65 19.81 10.92 27.94 34.16 0.15 1.78 2.84 5.84 10.34 22.10 1.335 0.004 0.060 0.102 0.190 0.395 0.850 5.59 5.08 3.28 9.91 20.82 11.18 0.119 0.380 0.780 0.430 1.100 1.345 0.006 0.070 0.112 0.230 0.407 0.870 TYP MA X . 5.84 MI N . 0.220 0.200 0.129 0.390 0.820 0.440 inch T YP MA X. 0.230
Figure 16. M244 Package Dimensions
Controlling Dimension: Inches
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SD2942
6 Revision History
6
Revision History
Dat e 18-Oct-2005 04-Jan-2006 Revision 1 2 Description of Changes First Issue. C om plete version
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6 Revision History
SD2942
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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