STMUX3040
NEATSwitchTM: octal SPDT high bandwidth signal switch
Features
Supports 3.0 Gbps generic data rate Octal SPDT switch to support 2 PCI lanes Low RON: 5.5 typical Internal voltage regulator VCC operating range: 1.65 - 2.0 V (internal regulator bypassed) 2.7 - 3.6 V (internal regulator active) Low current consumption: 150 A ESD HBM model: 2 kV Channel on capacitance: 6 pF typical Switching time speed: 9 ns Near to zero propagation delay: 250 ps Bandwidth: -3 dB at 1200 MHz Low crosstalk: -20 dB at 1200 MHz Bit-to-bit skew: 50 ps typical Data and control inputs provide undershoot clamp diode Wide bandwidth minimizes skew and jitter Hot insertion capable Supports bidirectional operation Supports PCI-E gen. 1, display ports, LVDS, TMDS and video signaling -40 C to 85 C operating temperature range TQFN42
Description
The STMUX3040 is a differential octal single pole double throw (SPDT) bidirectional signal switch with low RON. It is designed to support various standards such as PCIe gen 1, LVDS, TMDS and video signaling. The STMUX3040 features very low cross-talk, low bit-to-bit skew, high channel-to-channel noise isolation and low I/O capacitance. The STMUX3040 switch offers very little or practically no attenuation of the high speed signals at the outputs, thus preserving the signal integrity to pass stringent requirements.
Applications
Work station PC and notebooks
Table 1.
Device summary
Order code STMUX3040QTTR Package TQFN42 Packaging Tape and reel
October 2008
Rev 2
1/17
www.st.com 17
Contents
STMU X3040
Contents
1 2 Functional diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 2.3 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Device operation table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 4
Internal voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 4.2 Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 5.2 5.3 5.4 5.5 5.6 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Power supply characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dynamic electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dynamic switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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STMUX3040
Functional diagrams
1
Functional diagrams
Figure 1. Functional diagram (switches)
Figure 2.
Functional diagram (internal regulator)
3.3V to 1.8V Voltage Regulator (Bypassed when V33 < 2.2V)
V33 (2.7V-3.3V)
Vreg and VCC
GND
GND
3/17
Pin settings
STMU X3040
2
2.1
Pin settings
Pin connection
Figure 3. Pin connection (top through view)
Vcc
42
GND
41
Vcc
40
GND
39 38 37
GND A0 A1 GND Vcc A2 A3 V33 SEL GND A4 A5 Vcc GND A6 A7 GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
0B1 1B1 2B1 3B1
34 33 32 31 30 29 28 27 26 25 24 23 22
0B2 1B2 2B2 3B2 Vreg 4B1 5B1 6B1 7B1 4B2 5B2 6B2 7B2
Vcc
GND
Vcc
GND
TQFN42
4/17
STMUX3040
Pin settings
2.2
Pin description
Table 2. Pin description
Pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin name GND A0 A1 GND Vcc A2 A3 V33 SEL GND A4 A5 Vcc GND A6 A7 GND Vcc GND Vcc GND
7B2 6B2 5B2 4B2 7B1 6B1 5B1
Function Ground Switch Switch Ground 1.65 - 2.0 V supply Tied to VREG if V33 > 2.2 V Switch Switch 2.7 V 3.3 V (internal regulator active) 1.65 2.0 V (internal regulator bypassed) Switch select pin Ground Switch Switch 1.65 2.0 V supply Tied to VREG if V33 > 2.2 V Ground Switch Switch Ground 1.65 2.0 V supply Tied to VREG if V33 > 2.2 V Ground 1.65 2.0 V supply Tied to VREG if V33 > 2.2 V Ground Switch Switch Switch Switch Switch Switch Switch
5/17
Pin settings Table 2. Pin description (continued)
Pin number 29 30 31 32 33 34 35 36 37 38 39 40 41 42 Pin name
4B1
STMU X3040
Function Switch Output of internal regulator 22 nF capacitor required here Switch Switch Switch Switch Switch Switch Switch Switch Ground 1.65 2.0 V supply Tied to VREG if V33 > 2.2 V Ground 1.65 2.0 V supply Tied to VREG if V33 > 2.2 V
VREG
3B2 2B2 1B2 0B2 3B1 2B1 1B1 0B1
GND Vcc GND Vcc
2.3
Device operation table
Table 3. Operation table
SEL L H Function AN to NB1 AN to NB2
6/17
STMUX3040
Internal voltage regulator
3
Internal voltage regulator
The STMUX3040 is integrated with an internal voltage regulator. The voltage regulator is activated when the supply voltage to the Vreg pin is more than 2.7 V. If the supply to Vreg is less than 2.2 V, the regulator is bypassed. Figure 4. Internal voltage regulator
Vcc
42 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
G ND
41
Vcc
40
G ND
39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
GND A0 A1 GND Vcc A2
0B1 0B1 1B1 2B1 3B1 0B2 1B2 2B2 3B2 Vreg 4B1 5B1 6B1 7B1 4B2 5B2 6B2 7B2 GND
2.7V3.3V
A3 V33 SEL GND A4 A5 Vcc GND A6 A7 GND
22nF
19
20
21
Vcc
G ND
Vcc
G ND
When the internal regulator is activated:
V33 is used as supply input Vreg is used as output of the internal regulator, a 22 nF capacitor should be connected from this pin to ground VCC, V33 and Vreg are all connected to 1.8 V supply
When internal regulator is not used:
7/17
Maximum rating
STMU X3040
4
Maximum rating
Stressing the device above the rating listed in the "Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
4.1
Absolute maximum rating
Table 4.
Symbol VCC V33 VI VIC IO TSTG TL
Absolute maximum rating
Parameter Supply voltage to ground Supply voltage to internal regulator DC input voltage DC control input voltage DC output current Storage temperature Lead temperature (10 sec) Value -0.5 to +2.5 -0.5 to +4.5 -0.5 to Vcc (1) -0.5 to Vcc 120 -65 to +150 300
(1)
Unit V V V V mA C C
1. VCC = 1.8 V 10% in regulator mode.
4.2
Thermal data
Table 5.
Symbol
RthJA
Thermal data
Parameter Thermal resistance junction-ambient Value 40.8 Unit C/W
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STMUX3040
Electrical specification
5
5.1
Electrical specification
DC electrical characteristics
TA = -40 to +85C, VCC = 1.8 V 10% Table 6. SEL pin
Symbol VIH VIL VIK IIH IIL Parameter High level input voltage Low level input voltage Clamp diode voltage Input high current Input low current Test conditions High level guaranteed Low level guaranteed VCC = 1.8 V, IIN = -18 mA VCC = 1.8 V VIN = VCC VCC = 1.8 V, VIN = GND Min 0.65 Vcc -0.5 -0.8 0.35 Vcc -1.2 5 5 Typ Max Unit V V V A A
Table 7.
Symbol
All signal switch pins
Parameter Test conditions VCC = 1.8 V VIN = VCC All non-tested switches floating VCC = 1.8 V, IIN = -18 mA VCC = 1.8 V VIN = 0.9 to VCC IIN = -30 mA VCC = 1.8 V VIN = 0.9 to VCC IIN = -30 mA VCC = 1.8 V VIN = 0.9 to VCC IIN = -30 mA -0.8 Min Typ Max Unit
IIN
Input leakage
1
uA
VIK
Clamp diode voltage
-1.2
V
RON
Switch ON resistance (1)
5.5
8.0
RFLAT
ON resistance flatness
(1) (2)
1
1.3
RON
ON resistance match between channels RON = RONMAX - RONMIN
(2) (3)
0.5
1
1. Measured by voltage drop between channels at the indicated current through the switch. 2. Flatness is defined as the difference between the RONMAX and the RONMIN of the ON resistance over the specified range on the same channel. 3. RON measured at the same VCC, temperature and voltage level.
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Electrical specification
STMUX3040
5.2
Capacitance
Table 8.
Symbol COFF CON
Capacitance (TA = 25C, f = 1 MHz)
Parameter Test conditions Min Typ 4 6 Max Unit pF pF
Por t x0 to port x1, switch off VIN = 0 V Capacitance switch on VI N = 0 V
5.3
Power supply characteristics
Table 9.
Symbol VCC V33 (
Power supply characteristics (TA = -40 to +85 C)
Parameter Supply voltage (internal regulator inactive) Supply voltage (internal regulator active) Quiescent power supply current (internal regulator inactive) Quiescent power supply current (internal regulator active) VCC = 2.0 V, VIN = VCC or GND V33 = 3.3V, VIN = 1.8V or GND Test conditions Min 1.65 2.7 Typ 1.8 3.3 Max 2.0 3.6 Unit V V
ICC
150
500
A
ICC
250
700
A
5.4
Dynamic electrical characteristics
Table 10.
Symbol
Dynamic electrical characteristics (TA = -40 to +85 C, VCC = 1.8 V 10%)
Parameter Test conditions RL = 100 , f = 300 MHz Min Typ Max -30 -20 -20 -35 -28 -20 3.0 -3dB bandwidth 1200 1300 Unit dB dB dB dB dB dB Gbps MHz
XTALK
Non-adjacent channel Cross-talk
RL = 100 , f = 600 MHz RL = 100 , f = 1200 MHz RL = 100 , f = 300 MHz
OIRR
Off isolation
RL = 100 , f = 600 MHz RL = 100 , f = 1200 MHz
DR BW
Data rate per channel Bandwidth
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STMUX3040
Electrical specification
5.5
Dynamic switching characteristics
Table 11.
Symbol tPD tPZH, tPZL tPHZ, tPLZ tSK(O)
Dynamic switching characteristics (TA = -40 to +85 C, VCC = 1.8 V 10%)
Parameter Propagation delay Line enable time, SEL to x to x0 or x to x1 Line disable time, SEL to x to x0 or x to x1 Output skew between center port to any other port Skew between opposite transition of the same output (tPHL - tPLH) Switching delay Switching delay Test conditions VCC = 1.65 V - 2.0 V VCC = 1.65 V - 2.0V VCC = 1.65 V - 2.0 V 0.5 0.5 Min Typ 0.25 6.5 6.5 9 8.5 Max Unit ns ns ns
VCC = 1.65 V - 2.0 V
50
100
ps
tSK(P) tON tOFF
VCC = 1.65 V - 2.0 V VCC = 1.65 V - 2.0 V VCC = 1.65 V - 2.0 V
50
100 50 30
ps ns ns
5.6
ESD performance
Table 12.
Symbol
ESD performance
Parameter Test conditions Air discharge (10 pulses) Min Typ 2 2 Max Unit kV kV
ESD
IEC-61000-4-2 Contact discharge (10 pulses)
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Package mechanical data
STMUX3040
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. Package dimensions
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STMUX3040
Package mechanical data
Table 13.
TQFN42 mechanical data
Millimeters
Symbol Min A A1 A3 b D D2 E E2 e L 0.30 0.20 3.40 2 8.90 7.50 0.70 0 Typ 0.75 0.02 0.20 0.25 3.50 2.05 9 7.55 0.50 0.40 0.50 0.30 3.60 2.10 9.10 7.60 Max 0.80 0.05
Figure 6.
TQFN42 footprint recommendations
13/17
Package mechanical data Figure 7. Tape information
STMUX3040
14/17
STMUX3040 Figure 8. Reel information
Package mechanical data
15/17
Revision history
STMU X3040
7
Revision history
Table 14.
Date 05-Jul-2007
Document revision history
Revision 1 Initial release. Content reworked to improve readability, no technical content change. Modified: title and datasheet cover page. Added: Figure 7: Tape information on page 14, Figure 6: TQFN42 footprint recommendations on page 13 and Figure 8: Reel information on page 15. Changes
09-Oct-2008
2
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STMUX3040
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