GS-BT2416C1.H
Bluetooth class 1 module with embedded HCI FW
Features
Bluetooth specification V.1.2 compliant Transmission rate up to 721 Kbps Output power class 1 ( 20 dBm max) Working distance up to 100 meters ACL and SCO links AFH interference resistance Supports USB (1.1) /UART/PCM (pulse code modulation)/SPI/ I²C interfaces Optimized link manager and control Support wireless LAN coexistence in collocated scenario Integrated 4 Mbit Flash, 64 Kbytes RAM, 4 Kbytes ROM 3.3 V single supply voltage Hardware based UART flow control
Description
ST Bluetooth modules are highly integrated for easy implementation in embedded applications. Class 1 modules enable wireless communication with other Bluetooth enabled devices up to 100 m away. The GS-BT2416C1.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 kHz and 13 MHz oscillator, Vreg as well PA function. The module embeds customer framework up to HCI level allowing interoperability with HCI top resident on Host. The antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be SMA aerial or a low cost antenna trace designed on PCB. For more details pleas refer to GS-BT2416C1DB application note. The GS-BT2416C1.H is the HCI module of the GS-BT2416C1.xx series. GS-BT2416C1.H is BQB pre-qualified. Conformance testing through Bluetooth qualification program enables a fast time to market after system integration by ensuring a high degree of compliance and interoperability.
Applications
Serial cable replacement Industrial control Laptops POS terminals Data acquisition equipment Internet access points Machine control Sensor monitoring Robotic and bionic control Security control Patient monitoring Audio gateway applications Hands-free sets Wireless printers Cordless terminals Laptops, PCs and accessories Hand held devices and accessories HID devices (keyboard, mouse, joystick, game controller...)
May 2008
Rev 2
1/19
www.st.com 19
Contents
GS-BT2416C1.H
Contents
1 2 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Bluetooth section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 5.2 5.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.1 8.2 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9 10 11 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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GS-BT2416C1.H
Ce rtif ic at ions
1
Certifications
CE compliant (IMQ Exp. opinion 0081-AREF00017) Safety EN60950-1 (2001) EMC EN301 489 17V1.2.1 Radio ES 300 328 V1.6. FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please refer to GS-BT2416C1DB application note) FCC ID: S9NBT2416C1DB
BQB compliant
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Maximum ratings
GS-BT2416C1.H
2
2.1
Maximum ratings
Absolute maximum ratings
Absolute maximum ratings (see Table 1) indicate limits beyond which damage to the device may occur. Sustained exposure to these limits will adversely affect device reliability. Operating ranges (see Table 2) define the limits for functional operation and parametric characteristics of the module. Functionality outside these limits is not implied. Table 1.
Symbol VDD VIN Tstg Tsold
Absolute maximum ratings
Values Parameter Min Module supply voltage Input voltage on any digital pin Storage temperature Soldering temperature Max 4 Vss1-0.5 Vdd+0.3 -40 +85 240 V V C Unit
2.2
Operating ranges
Table 2.
Symbol VDD Tstg
Operating ranges
Values Parameter Module supply voltage Operating ambient temperature Conditions Min - 20 C < T < 70 C 3.13 -20 Typ 3.3 Max 3.47 +70 V C Unit
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GS-BT2416C1.H
Electrical characteristics
3
3.1
Electrical characteristics
DC I/O specification
Table 3.
Symbol Vil Vih Vhyst Vol Voh
DC input / output specification
Values Parameter Low level input voltage High level input voltage Schmitt trigger hysteresis Low level output voltage High level output voltage Conditions Min 3.13 V < VDD < 3.47 V 3.13 V < VDD < 3.47 V 3.13 V < VDD < 3.47 V Io load = pin drive capability Io load = pin drive capability VDD0.15 2 0.4 0.15 Typ Max 0.8 V V V V V Unit
4
Bluetooth section
Table 4.
Symbol CHs Hop 13M CK
Bluetooth section
Values Parameter Channel space Hopping System clock System clock stability - 20 C to 70 C - 20 32 - 200 200 721 432 180 60 Conditions Min Typ 1 1600 13 20 Max MHz Hops/ sec MHZ ppm kHz ppm Kbits/ sec Kbits/ sec mA mA Unit
LP CK
Low power clock Low power clock accuracy
Tra Trs
Transmission rate asynchronous Transmission rate synchronous Operation current TX mode
Iop Operation RX mode
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Bluetooth section
GS-BT2416C1.H
4.1
RF performance characteristics
In the performance characteristics table the following applies:
Test condition: nominal Voltage typical Vdd 3.3 V Temperature typical TA = 25 C
Parameters are given at antenna pin Table 5.
Symbol
Transmitter and receiver performance characteristics
Parameter Conditions 2.402 GHz Min Typ 18 18 18 - 36 - 44 - 84 Ma x 20 20 20 Unit dBm dBm dBm dBm dBm dBm
TX Pout
TX output power
2.441 GHz 2.480 GHz
ACP RX sens
TX output spectrum adjacent channel power Receiver sensitivity
lM-Nl = 2 lM-Nl 3 @BER 0.1 %
Table 6.
Symbol RF in RF out TX out F
Synthesizer performance characteristics
Parameter Input and output frequency range TX output spectrum at -20 dB Bandwidth TX initial carrier frequency tolerance DH1 data packet - 75 Conditions Min 2402 920 Typ Ma x 2480 1000 75 25 40 40 20 Unit MHz kHz kHz kHz kHz kHz Hz
lF pn l
TX carrier frequency drift
DH3 data packet DH5 data packet
lF/50sl
Drift rate
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GS-BT2416C1.H
Integrate firmware
5
Integrate firmware
The GS-BT2416C1.H includes customer framework up to HCI (host control interface) Figure 1. HCI firmware implementation
HCI Top
resident on the Host
HCI Physical
HCI Bottom Serial Interface Layer UART, USB, ...
SCO channels Synchronous Connection Oriented
resident on the Module
AUDIO
HCI FIRMWARE
LINK MANAGER
Host Control Interface Between lower and upper levels Set up, manage and secure the link: it's responsible for paging, including ACL, SCO, inquiry, authentication, encryption, low consumption...
Hardware Layer
Set up the physical connection
BASEBAND HW RF H W
5.1
Features
The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications.
5.2
Command interface
The HCI commands are accessible through the serial port using the host control SW any HCI SW for example bluesoleil (most popular Bluetooth PC open SW).
5.3
Usage scenarios
The module with embedded HCI FW is completely open to any custom implementation, strictly depending on the BT stack and profiles that will be added. Module can be configured both as master or slave. Master can support point to point connection or standard point to multi point Pico net up to seven points.
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Application information
GS-BT2416C1.H
6
Application information
Here below there are some suggestions to better implement the module in the final application.
Module is usually put on a motherboard, avoid that traces with switching signals are routed below the module. The best would be to have a ground plane underneath the module. Connect the supply voltage ground of the module with the other grounds present on the motherboard in a star way. Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Module foot print
Figure 2.
Module foot print
Supply voltage GND
RF gnd
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GS-BT2416C1.H
Application information
6.1
Antenna reference
RF output pin must be connected to an antenna which could be:
Antenna directly printed on the pcb (Figure 3.) Integrated antenna as, for example, antenova 30-30-A5839-01, Murata ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. (Figure 4.) External antenna connected by means a SMA connector (Figure 5.) Figure 4. Antenna examples Figure 5. SMA connector for external antenna
Figure 3.
Antenna on PCB
Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0) of 50 to get the maximum power transfer. Matching for 50 is depending on the various factors, elements to be taken into consideration are: Type of material, i.e. FR4 The electrical characteristics of the material, i.e. the r, electric constant at 2.4 GHz Mechanical dimensions of the PCB and traces, i.e. PCB thickness, trace/ reference ground thickness, trace width, trace thickness. Just to give an example, using a 1 mm thick FR4 board, with an r = 4.3 at 2.4 GHz, with Cu thickness of 41 m, the resulted width of 50 strip-line is 1.9 mm (Microstrip type calculation). Parameters for trace matching
Figure 6.
Trace width
Trace thickness
PCB thickness
r (Dielectric constant)
Reference ground
Tools for calculating the characteristic impedance, based on the physical and mechanical characteristics of the PCB, can be easily found on the web.
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Block diagram
GS-BT2416C1.H
7
Block diagram
Figure 7. Block diagram
RF antenna UART USB PCM SPI I²C GPIO STLC2416 Baseband ARM7 proc STLC2150 Radio chip LNA PA SW Filter 32kHz XTAL 32kHz XTAL
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GS-BT2416C1.H
Pin settings
8
8.1
Pin settings
Pin connections
Figure 8. Pin connection diagram
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Pin settings
GS-BT2416C1.H
8.2
Table 7.
Pin N
Pin descriptions
Pin descriptions
Name I/O Description
Power, ground and system signal 1 2 41 42 43 44 45 46 13 26 Vss1 Vdd 1V8 3V3 Vss1 2V7 RESET BOOT LP CLOCK OUT INT1 ----O O --O I I O I GND Module supply voltage- single 3.3 V 1.8 V digital supply out (test purpose) to be left not connected 3.3 V I/O power supply out (test purpose) to be left not connected GND (test purpose) to be left not connected 2.7 digital core supply out (test purpose) to be left not connected Reset pin (active low) External downloading enable (active low) internally pull-upped to 1.8 V by 10 k 32 kHz out External Interrupt signal internally connected to VSS1 with 10 k / If not used connect to VSS1
General purpose signals 3 4 5 6 7 8 10 11 12 14 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO7 GPIO8 GPIO9 GPIO11 I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line
No connect signals 9 15 16 17 18 ---------------I/O Not to be used internally used for RX/TX switch I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting
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GS-BT2416C1.H Table 7.
Pin N
Pin settings
Pin descriptions (continued)
Name I/O Description
Test interface signals 19 20 21 22 23 TDI TDO TMS NTRST TCK ----------JTAG pin JTAG pin JTAG pin JTAG pin JTAG pin If not used connect to VSS1
I2C interface signals 24 25 I2C_dat I2C_clk I/O I2C bus interface data to be connected to VDD with 10 k resistor I/O I2C bus interface clock to be connected to VDD with 10 k resistor
PCM interface signals 27 28 29 30 PCM_SYNC PCM_CLK PCM_A PCM_B I/O PCM 8 kHz synch I/O PCM clock I/O PCM data in/out I/O PCM data in//out
USB interface signals 31 32 USB_DN USB_DP I/O USB data - If not used connect to VSS1 I/O USB data + If not used connect to VSS1
UART interface signals 33 34 35 36 47 48 UART2_RXD UART2_TXD UART2_I1 UART2_02 UART10_TXD UART11_RXD I O I O O I UART2 data input If not used connect to VDD UART2 data output UART2 clear to send input If not used connect to VDD UART2 ready to send output UART1 data output UART1 data input If not used connect to VDD
SPI interface signals 37 38 39 40 SPI_FRM SPI_CLK SPI_TXD SPI_RXD I/O Synchronous serial interface frame synch I/O Synchronous serial Interface clock O/T Synchronous serial Interface transmit data I Synchronous serial Interface receive data If not used connect to VSS1
Antenna signals 49 50 51 Vss2 ( RF GND) +ANTENNA Vss2 (RF GND) ------RF GND Antenna out RF GND
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Soldering
GS-BT2416C1.H
9
Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Table 8. Soldering
Profile feature Average ramp up rate (TSMAX to TP) Preheat Temperature min (TS min) Temperature max (TS max) Time (tS min to tS max) (tS) Time maintained above: Temperature TL Time tL Peak temperature (Tp) Time within 5 C of actual peak temperature (tP) Ramp down rate Time from 25 C to peak temperature PB free assembly 3 C / sec max 150 C 200 C 60 100 sec 217 C 40 70 sec 240 + 0 C 10 20 sec 6 C / sec 8 minutes max
Figure 9.
Soldering
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GS-BT2416C1.H
Mechanical dimensions
10
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 10. Mechanical dimensions
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Mechanical dimensions Figure 11. Land pattern
GS-BT2416C1.H
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GS-BT2416C1.H
Ordering information scheme
11
Ordering information scheme
Table 9. Ordering information scheme GS-BT
Bluetooth modules
2416
C1
H
V 1.2 compliant
Class 1
Embedded HCI
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Revision history
GS-BT2416C1.H
12
Revision history
Table 10.
Date 31-Aug-2006 27-May-2008
Revision history
Revision 1 2 First release Updated: Cover page Added: Section 9 on page 14 Changes
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GS-BT2416C1.H
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