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Ultra Small Leadless Packages
Bump Chip Carrier Packages (BCC)
The Bump Chip Carrier packages are particularly suitable for low pin count applications (from 8 to 64 I/Os) and can optimize RF applications due to the short connection between die bonding pads and bumps.
Thinner than Ultra thin Fine pitch BGA (UFBGA) packages -- 0.8mm versus 1.0mm -- BCC packages are ideal for portable applications. They are developed by ST for specific customer dedicated applications.
 
Bump Chip Carrier Packages (BCC)

BCC++ is the thermal enhanced version of BCC
 
BCC Packages Availability
Pin Package Size Terminal Pitch Max Die Size (mm) BCC Max Die Size (mm) BCC++
8 2.80 x 3.80 x 0.80 0.50mm 1.6x1.8 1.3x1.5
16 3.40 x 4.55 x 0.80 0.65mm 1.2x2.35 0.9x2.05
20 4.20 x 5.20 x 0.80 0.65mm 2x3 1.7x2.7
24 4.00 x 4.00 x 0.80 0.50mm 1.8x1.8 1.5x1.5
32 5.00 x 5.00 x 0.80 0.50mm 2.8x2.8 2.5x2.5
48 7.00 x 7.00 x 0.80 0.50mm 4.8x4.8 4.5x4.5
64 9.00 x 9.00 x 0.80 0.50mm 6.8x6.8 6.5x6.5
 

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System-on-Chip
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