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| Ball Grid Array Packages (BGA) |
ST's offer in BGA packages fits all customer needs with a wide range of solutions: from Plastic BGA to Thin Fine Pitch BGA (TFBGA) down to 0.5mm ball pitch.
ST advanced BGA packaging technology allows designers to optimize applications requiring high-performance -- reliability, thermal and electrical performance -- and body size reduction.
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| Flip-Chip Chip Scale Packaging (CSP) |
Flip-Chip technology is based on solder balls interconnections bumped on the BGA package.
There is no more wire bond pads to connect the die to the leads. The solder balls connect directly the die to the package. This kind of connection allows a significant improvement of electrical performance -- low impedance and low inductance.
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| IPAD Flip-Chip Chip Scale Packages |
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| Thin Quad Flat Packages |
| Body Dimensions |
Lead Counts |
| 7x7x1.40 |
32/ 48 |
| 10x10x1.40 |
44/ 64 |
| 14x14x1.40 |
44 / 64 / 80 / 100 |
| 20x20x1.40 |
144 |
| 24x24x1.40 |
176 |
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| Ultra Small Leadless Packages |
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