“This agreement to produce the digital baseband is testament to ST’s world renowned ability to develop and produce cutting-edge semiconductor products for current and future generations of 3G mobile communications technology,” said Eric Aussedat, Group Vice-President and General Manager of ST’s Cellular Communication Division. “Ericsson Mobile Platforms’ is the leading independent platform supplier in the world, and this agreement further strengthens ST’s position as a leading chip supplier in the mobile handset market.”

ST is one of the world leaders in ICs for mobile communications ICs and offers an extensive portfolio of chips designed for use in mobile handsets and phones, including camera image sensors, Bluetooth and Wireless-LAN connectivity ICs, RF (radio-frequency) ICs, energy management chips, NOR and NAND Flash memories, discrete components, and also the award-winning Nomadik™ Multimedia Application Processor, which delivers world-beating video and audio performance to mid- to high-end multimedia phones and terminals.

About Ericsson Mobile Platforms
Ericsson Mobile Platforms offers complete, end-to-end interoperability tested platforms for 2.5 and 3G. A common software platform for GPRS, EDGE and WCDMA/GPRS terminals enables application portability, stability and security, and ensures best-in-class outcomes regarding power consumption and size.

The technology is based on Ericsson’s global leadership of standardization work and the world’s strongest intellectual property rights for 2.5 and 3G systems.

Ericsson Mobile Platforms’ offering includes reference design, platform software, ASICs and development boards, development and test tools, industrialization software, support, training and documentation.

Ericsson Mobile Platforms is a business unit within the Ericsson Group.