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STMicroelectronics Unveils its Next-Generation Integrated Bluetooth® and FM-Radio Transceiver System on Chip in 65nm Process Technology
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This combination of features and functionality saves space and costs for manufacturers of portable products, while delivering to consumers stereo FM R(B)DS reception (RX) direct to their Bluetooth headsets. The fully integrated short range FM R(B)DS transmitter (TX) allows users to enjoy stored music content on any in-car or home FM radio tuner and delivers increased versatility to the mobile device.
“This state-of-the-art addition to our portfolio builds upon the highly successful and market proven Bluetooth/FM products already chosen by many leading handset makers. We are proud that it demonstrates ST’s continuing leadership and commitment to providing world-class connectivity devices,” said Leon Cloetens, Vice President and General Manager of ST’s Connectivity Division. “STLC2690 is just the first of a wider family of 65nm connectivity solutions that will become available during 2008 and beyond.” The STLC2690 is compliant with BT v2.1+EDR and further increases the field-proven class-1.5 Bluetooth output power, requiring only one supply voltage and without any calibration in production. The Bluetooth link stability is dramatically increased by also further improving the Bluetooth receiver sensitivity, while reducing the best-in-class current consumption by up to 35% compared to former generation products in 130nm technology.
The integrated FM receiver sets a new world standard for receiver sensitivity and with real-time programmable filters for optimum search and sensitivity stability, the STLC2690 can also be used with integrated FM antennas. The device supports all deployed R(B)DS services and all worldwide FM bands (65 to 108MHz). The short-range FM transmitter is specifically designed for use in mobile phones that also take advantage of the presence of a FM receiver. Proprietary SureTune™ technology automatically selects the optimal FM transmit frequency, while the programmable high output power allows stable operation even when using integrated antennas with poor efficiency. The STLC2690 delivers a stable and user-friendly FM transmission implementation with real enhancement of the user experience in mobile applications. The new STLC2690 comes in a Wafer Level Chip Scale Package (WLCSP) with a 0.4mm pitch. Its ultra-low external BOM count allows a PCB footprint as small as 36mm2. The pin-out arrangement of the STLC2690 is also suitable for use on low-cost PCB assemblies. STLC2690 samples are already being evaluated by several leading handset manufacturers and volume mass production is scheduled for the second half of 2008. Further information on ST’s Bluetooth and FM devices and its complete Bluetooth portfolio at www.st.com/bluetooth. Click here for the high-resolution photo
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This new chip from ST is manufactured in ST’s advanced low-leakage ultra-low-power 65nm RFCMOS technology, and reinforces ST’s position of being able to offer the lowest power consumption in the Bluetooth world.
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